Product

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PCB Laser Cutting System
MLC 3000
With the MLC 3000 series, different power levels (depending on the thickness of the PCB) can be configured. The PCB panels can be loaded and unloaded manually. As a result of mechanical de-paneling's inherent mechanical stress, traditional mechanical de-paneling methods are not only noisy and dusty on the production floor, but tend to also increase the scrap rate, especially if the PCBs include sensitive components such as sensors. 
Feature
  • Barcoding for traceability
  • Auto module Pick & Place for loading & unloading
  • Vision PRS
  • Laser Jet Solder
  • Automatic alignment system
  • Jet solder AVI
Advantage
  • Extreme high UPH
  • High soldering yield of >99%
  • Requires no additional cleaning
  • Non-contact  processing
  • Reduces manpower