Product

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PCB Laser Cutting System
MLC 4000
MLC 4000 upgrade and enhancement on the processing speed which lead to higher UPH. It utilizes a high power UV laser and the contactless and cold cutting of UV laser not only eliminates this mechanical stress with other cutting method but also improved the cut quality and reduces scraps and rework.
Feature
  • UV / Green laser up to 20W
  • High peak power and short pulse width
  • Low HAZ at cut edge (cold cutting)
  • Laser Jet Solder
  • Excellent gaussian beam quality (M2<1.3)
  • Precise accuracy at +/-10um
Advantage
  • High cutting speed, high throughput
  • Cutting yield of >99.9%
  • Non-contact stress free process
  • Dual shuttle working